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Enhanced hydrogen production from aqueous methanol solution using TiO

Paramasivan GOMATHISANKAR,Tomoko NODA,Hideyuki KATSUMATA,Tohru SUZUKI,Satoshi KANECO

Frontiers of Chemical Science and Engineering 2014, Volume 8, Issue 2,   Pages 197-202 doi: 10.1007/s11705-014-1417-y

Abstract: production from aqueous methanol solution using titanium dioxide (TiO ) was investigated in the addition of metal

Keywords： photocatalytic hydrogen generation     methanol     copper particles     TiO2     metal-semiconductor interface    

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Liquid metal printing opening the way for energy conservation in semiconductor manufacturing industry

Frontiers in Energy 2022, Volume 16, Issue 4,   Pages 542-547 doi: 10.1007/s11708-022-0834-8

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Experimental verification of the interface wave method to detect interlaminar damage of a metal multilayer

Bing LI,Xu GENG,Tong LU,Lei QIANG,Minghang LI

Frontiers of Mechanical Engineering 2015, Volume 10, Issue 4,   Pages 380-391 doi: 10.1007/s11465-015-0365-7

Abstract:

The interface wave traveling along the boundary of two materials has been studied for nearly a centuryHowever, experiments, engineering applications, and interface wave applications to the non-destructiveFirst, the wave velocity and wave structure of Stoneley waves at a perfectly bonded aluminum-steel interface

Keywords： crack localization     interface waves     Stoneley waves     interlaminar damage     multilayer structure    

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High heat flux thermal management through liquid metal driven with electromagnetic induction pump

Frontiers in Energy 2022, Volume 16, Issue 3,   Pages 460-470 doi: 10.1007/s11708-022-0825-9

Abstract: In this paper, a novel liquid metal-based minichannel heat dissipation method was developed for coolingto achieve a pressure head of 160 kPa and a flow rate of 3.24 L/min, which could enable the liquid metalThe liquid metal-based minichannel thermal management system was established and tested experimentallyThe results show that the liquid metal cooling system can dissipate heat flux up to 242 W/cm2metal thermal grease is introduced to efficiently reduce the thermal contact resistance (a

Keywords： high heat flux     liquid metal     electromagnetic pump     minichannel heat sink     thermal interface material    

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Recent advances of hydrogen production through particulate semiconductor photocatalytic overall water

Frontiers in Energy 2022, Volume 16, Issue 1,   Pages 49-63 doi: 10.1007/s11708-022-0817-9

Abstract: Solar energy-driven photocatalytic water splitting has been investigated for decades to produce clean and renewable green hydrogen. In this paper, the cutting-edge research within the overall water splitting system is summarized from the one-step photocatalytic overall water splitting (POWS) system to the two-step system and the cocatalysts research in this field. In addition, the photocatalytic reaction engineering study is also reviewed which is crucial for future scale-up. This mini-review provides a picture of survey of recent progress of relevant overall water splitting system, with particular attention paid to material system and mechanistic breakthroughs, and highlights the challenge and opportunity of the current system.

Keywords： photocatalysis     overall water splitting     hydrogen    

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Cystine-assisted accumulation of gold nanoparticles on ZnO to construct a sensitive surface-enhanced Raman spectroscopy substrate

Frontiers of Chemical Science and Engineering 2023, Volume 17, Issue 1,   Pages 15-23 doi: 10.1007/s11705-022-2177-8

Abstract: Recently, various semiconductor/metal composites have been developed to fabricate surface-enhanced RamanHowever, low metal loading on semiconductors is still a challenge.Morphological analysis revealed that the obtained ZnO/Au/cystine composite not only had a higher metalThis study provided a promising method to fabricate sensitive semiconductor/noble metal-based surface-enhanced

Keywords： biomineralization     cystine     semiconductor/metal composite     SERS detection     Raman detection    

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Advantageous mechanochemical synthesis of copper(I) selenide semiconductor, characterization, and properties

Frontiers of Chemical Science and Engineering 2022, Volume 16, Issue 3,   Pages 433-442 doi: 10.1007/s11705-021-2066-6

Abstract: Copper(I) selenide-nanocrystalline semiconductor was synthesized via one-step mechanochemical synthesis

Keywords： Cu2Se     berzelianite     nanocrystalline semiconductor     mechanochemical synthesis     planetary ball    

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Strategic Study on the Development of Advanced Semiconductor Materials and Auxiliary Materials in China

Writing Group of Advanced Semiconductor Materials and Auxiliary Materials

Strategic Study of CAE 2020, Volume 22, Issue 5,   Pages 10-19 doi: 10.15302/J-SSCAE-2020.05.002

Abstract:

The rapid development of the third-generation semiconductor materialsSiC and GaN offers China a strategic opportunity to realize the independent control over its advanced semiconductorIn this paper, we analyze the development status of semiconductor materials and auxiliary materials inTo promote the development of advanced semiconductor materials and auxiliary materials in China, we suggestTo promote the innovative development of the semiconductor industry,China should adhere to government

Keywords： advanced semiconductor materials     auxiliary materials     third-generation semiconductor     2035    

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Novel slack-based robust scheduling rule for a semiconductor manufacturing system with uncertain processing

Juan LIU, Fei QIAO, Yumin MA, Weichang KONG

Frontiers of Engineering Management 2018, Volume 5, Issue 4,   Pages 507-514 doi: 10.15302/J-FEM-2018045

Abstract:

The NP-hard scheduling problems of semiconductor manufacturing systems (SMSs) are further complicated

Keywords： semiconductor manufacturing system     uncertain processing time     dynamic scheduling     slack-based robust scheduling    

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Developments in semiconductor thermoelectric materials

Laifeng LI, Zhen CHEN, Min ZHOU, Rongjin HUANG

Frontiers in Energy 2011, Volume 5, Issue 2,   Pages 125-136 doi: 10.1007/s11708-011-0150-1

Abstract: The objectives of this paper are to introduce the recent developments in semiconductor thermoelectric

Keywords： thermoelectric materials     thermoelectric figure of merit     applications    

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Effect of interface adhesion factor on the bearing capacity of strip footing placed on cohesive soil

Frontiers of Structural and Civil Engineering 2021, Volume 15, Issue 6,   Pages 1494-1503 doi: 10.1007/s11709-021-0768-y

Abstract: By considering the different values of interface adhesion factor (αcr) between the

Keywords： bearing capacity     soil-rock interface     Hoek−Brown yield criterion     plasticity     limit analysis    

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Ga(X)N/Si nanoarchitecture: An emerging semiconductor platform for sunlight-powered water splitting toward

Frontiers in Energy doi: 10.1007/s11708-023-0881-9

Abstract: materials developed, Ga(X)N/Si (X = In, Ge, Mg, etc.) nanoarchitecture has emerged as a disruptive semiconductor

Keywords： Ga(X)N/Si nanoarchitecture     artificial photosynthesis     water splitting     solar toward hydrogen    

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Multi-objective optimization of surface texture for the slipperswash plate interface in EHA pumps

Frontiers of Mechanical Engineering 2022, Volume 17, Issue 4, doi: 10.1007/s11465-022-0704-4

Abstract: multi-objective optimization model to obtain the arbitrarily surface textures design of the slipper/swash plate interface

Keywords： electro-hydrostatic actuator     axial piston pump     slipper/swash plate interface     multi-objective optimization    

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Thermal analysis of lubricated three-dimensional contact bodies considering interface roughness

Frontiers of Mechanical Engineering 2022, Volume 17, Issue 2, doi: 10.1007/s11465-022-0672-8

Abstract: The thermal behaviors of the contact interface are studied in a wide range of working conditions.

Keywords： thermal elastohydrodynamic lubrication     surface roughness effect     thermal effect     temperature characteristics     severe conditions    

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Progress and Prospect of Semiconductor Silicon Wafers in China

Zhang Guohu, Xiao Qinghua, Ma Fei

Strategic Study of CAE 2023, Volume 25, Issue 1,   Pages 68-78 doi: 10.15302/J-SSCAE-2023.01.002

Abstract: China's semiconductor silicon wafers are highly dependent on foreign trade.guarantee capability of silicon wafers is significant for improving the overall level of China’s semiconductorthe market-dominant 8-inch and 12-inch silicon wafers, analyzes the development status of the global semiconductorThe study specifically focuses on the development status of China's semiconductor silicon wafer industrysustainability, (3) supporting the coordinated development of the industrial chain, and (4) developing semiconductor

Keywords： semiconductor silicon wafer     8 inches     12 inches     industry synergy     advanced processing    

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Title Author Date Type Operation

Enhanced hydrogen production from aqueous methanol solution using TiO

Paramasivan GOMATHISANKAR,Tomoko NODA,Hideyuki KATSUMATA,Tohru SUZUKI,Satoshi KANECO

Journal Article

Liquid metal printing opening the way for energy conservation in semiconductor manufacturing industry

Journal Article

Experimental verification of the interface wave method to detect interlaminar damage of a metal multilayer

Bing LI,Xu GENG,Tong LU,Lei QIANG,Minghang LI

Journal Article

High heat flux thermal management through liquid metal driven with electromagnetic induction pump

Journal Article

Recent advances of hydrogen production through particulate semiconductor photocatalytic overall water

Journal Article

Cystine-assisted accumulation of gold nanoparticles on ZnO to construct a sensitive surface-enhanced Raman spectroscopy substrate

Journal Article

Advantageous mechanochemical synthesis of copper(I) selenide semiconductor, characterization, and properties

Journal Article

Strategic Study on the Development of Advanced Semiconductor Materials and Auxiliary Materials in China

Writing Group of Advanced Semiconductor Materials and Auxiliary Materials

Journal Article

Novel slack-based robust scheduling rule for a semiconductor manufacturing system with uncertain processing

Juan LIU, Fei QIAO, Yumin MA, Weichang KONG

Journal Article

Developments in semiconductor thermoelectric materials

Laifeng LI, Zhen CHEN, Min ZHOU, Rongjin HUANG

Journal Article

Effect of interface adhesion factor on the bearing capacity of strip footing placed on cohesive soil

Journal Article

Ga(X)N/Si nanoarchitecture: An emerging semiconductor platform for sunlight-powered water splitting toward

Journal Article

Multi-objective optimization of surface texture for the slipperswash plate interface in EHA pumps

Journal Article

Thermal analysis of lubricated three-dimensional contact bodies considering interface roughness

Journal Article

Progress and Prospect of Semiconductor Silicon Wafers in China

Zhang Guohu, Xiao Qinghua, Ma Fei

Journal Article